The full AI voice stack, delivered in the form your product needs
mpWAV provides the complete voice interface stack — single- and multi-microphone enhancement, wake-word detection, sound source localization, multi-party processing, speaker diarization, on-device speech recognition, and a conversational LLM.
Depending on your microphone configuration, compute platform, development stage, and production plan, it can be applied as software/SDK, a microphone array module, DSP·FPGA·AP porting, technology licensing, or semiconductor IP·SoC collaboration.
mpWAV's products and platforms are the software, AI models, hardware modules, and embedded implementations that package our voice algorithms for your product.
The same technology can be validated early with a PC-based SDK or PoC, while productization may require DSP·FPGA·AP porting, a microphone array module, or a semiconductor IP structure.
We don't just hand over technology — we shape it into something that runs inside your product.
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Development stage to product form mapping
Review→Software Evaluation | Data validation→SDK/PoC | Prototype→Edge AI/Mic Array/FPGA
Voice enhancement, wake-word, localization and speaker analysis, recognition, and dialogue — delivered as software or an SDK that fits into your current system.
mpNC
mpAEC
mpBeamforming
mpAB
mpWWD
mpS
mpLocalization
mpDiarization
mpASR
mpLLM
A good fit when
You want to validate performance on real data first
You want to improve the front end of your existing ASR
You want single- or multi-mic features in software
You are expanding meeting, kiosk, or robot service features
Technology collaboration around your data and goals
mpWAV's preprocessing, interaction analysis, recognition, conversational AI, or industrial acoustic analysis — licensed or co-developed for your product.
A good fit when
You are applying the technology to a product line long-term
You need optimization for specific industry data
You are developing hardware and software together
You need custom analysis such as factory anomaly detection
Dedicated structures for volume and miniaturization
Building on FPGA·DSP implementation experience, we review semiconductor IP or dedicated SoC collaboration that accounts for the power, size, and cost of volume products.
Official material presents voice interface chips for vehicles, consumer devices, and defense, plus semiconductor IP partnership and dedicated SoC expansion as business directions.
A good fit when
You need cost and power optimization for volume production
You need a dedicated chip structure for miniaturization
You are a semiconductor company exploring IP collaboration
On-device full stack (cycling inside the product, no cloud)
Wake Word → mpWWD → Voice Enhancement → mpASR → mpLLM → Local Product API
Microphone Array Module
From multi-channel capture to localization and preprocessing
Multi-microphone products must connect mic count and layout, channel synchronization, speaker output, and the AEC reference in one hardware structure.
mpWAV has multi-channel audio hardware design experience including the linear kiosk array and the hexagonal array built for CES.
mpBeamforming
Ambient noise reduction using multi-microphone spatial information
mpLocalization
Speech direction or user position estimation
mpAEC
Echo cancellation using the speaker reference
mpAB
Integrated echo and noise processing
mpASR
Converting the refined audio to text and commands
Examples from official material
Linear kiosk array
4- or 6-channel MEMS microphones
16 kHz·16-bit input
2-channel speaker output
48 kHz·16-bit output
CES hexagonal array
6-channel MEMS microphones
2-channel speaker output
2-channel AEC reference loop-back
※ These are design cases from official material and may differ from currently available standard product specifications. Contact us for supply options and specs.
The right product form depends on your development stage
Stage
Goal
Recommended product·platform
Planning
Feasibility review
Consultation·architecture design
Data collection
Analyzing the current problem
Software Evaluation·USB Audio
PoC
Before/after validation
SDK·AI Model·Evaluation Board
Prototype
Verifying real product behavior
Mic Array·FPGA·AP Integration
Integration
Running on the target platform
DSP·FPGA·AP Porting
Pre-production
Cost·power·update review
Module·License
Scale
Miniaturization and cost optimization
Semiconductor IP·Dedicated SoC
Early on, a software PoC identifies the technology you need; module and porting scope are best decided after hardware and the target platform are fixed.
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Stage selection flowchart
Real data? → Software PoC | Mic structure fixed? → Mic/HW Evaluation
When your microphones, speakers, compute platform, environment, and service goals are unique, mpWAV technology can be licensed or co-developed for your product.
Algorithm licensing
mpNC, mpAEC, mpBeamforming, mpAB, and acoustic analysis
AI model application
mpWWD, mpASR, and mpLLM optimized per product and domain
Interaction technology
mpS, mpLocalization, and mpDiarization connected to your systems
Hardware co-development
Microphone arrays, AEC reference, and processing boards integrated
Industry co-development
Systems built for robots, kiosks, vehicles, meetings, and factories
Follow-on expansion
Technology proven in the first product extended to other platforms and lines
For vehicles, smart devices, and volume products, size, power, and cost matter as much as processing performance.
Building on software algorithms, real-time FPGA implementation, and multi-channel hardware experience, mpWAV reviews voice interface IP·SoC collaboration with semiconductor companies and volume customers.
Technology blocks under review
mpAEC IP
mpBeamforming IP
mpAB integrated block
mpNC lightweight enhancement
mpWWD wake-word detection
Multi-channel Audio I/O
On-device mpASR
Per-product AI acceleration
Fields under review
Vehicles·mobility
Smart home·appliances
Robots·kiosks
Consumer smart devices
Defense·special environments
Official material presents voice interface chips and a dedicated SoC as business models and an expansion roadmap. This is currently a co-development and partnership area rather than an off-the-shelf standard chip; specifications and schedules are settled through consultation.
Full product timeline (requirements→analysis→data→stack→PoC→form→integration→API→field→production)
Requirements → Acoustic analysis → Data evaluation → Stack → PoC → Product form → Platform integration → API → Field → Production
Project Information
Share the following and we can review the right configuration
Product
Product or service type
Application field
Primary users
Usage locations
Development stage
Launch schedule
Expected volume
Acoustic structure
Microphone count
Microphone positions
Speaker count
AEC reference availability
User distance
Dominant noise
Multi-party speech
Required features
Single-mic noise reduction
Speaker echo cancellation
Multi-mic noise reduction
Wake-word detection
Direction estimation
Multi-party processing
Speaker separation
Speech recognition
Natural-language dialogue
Anomaly detection
System environment
CPU·MCU
DSP
FPGA
AP
GPU·NPU
Operating system
Memory
Latency budget
Data
Raw audio
Per-channel microphone data
Speaker reference
Ground-truth text
Existing ASR results
Failure cases
Menu·command·domain data
FAQ
Frequently asked questions about mpWAV products & platforms
Voice technology delivered as software·SDK, on-device AI, microphone array modules, DSP·FPGA·AP porting, technology licensing, and semiconductor IP·SoC collaboration.
The exact scope varies by technology and project.
Technologies can be applied as individual modules or connected into one integrated configuration.
Delivery units and licensing are agreed per project.
Yes.
mpNC is built for single-microphone input — earbuds and small smart devices that can't fit an array.
Yes.
mpNC, mpAEC, mpBeamforming, and mpAB apply in front of your existing ASR, improving the input audio.
Typically a linear microphone array, mpAB, mpASR, and mpLLM, integrated with your ordering system API.
mpS and mpDiarization process multi-party audio and separate speaker segments, then connect to mpASR.
It is being developed in the direction of a 1B-class on-device dialogue model.
Feasibility depends on model version, precision, memory, accelerators, and response-time requirements.
Official material presents the linear kiosk array and the CES hexagonal array as design cases.
Supply options, specifications, volumes, and lead times are arranged per project — contact us.
Voice interface chips and the SoC are an expansion direction the company is pursuing.
Today this proceeds as semiconductor IP and co-development collaboration, not an off-the-shelf standard chip.
Start with a software PoC based on your microphone count, speaker structure, required features, target platform, and stage — then choose the right delivery form.
See the technology and services behind the products
Design the voice technology and the delivery form together
Tell us your product type, mic·speaker structure, dominant noise, required features, and target platform — we will review the right mpWAV technology and delivery form.
From single-mic noise control to multi-channel echo and noise processing, wake·location·speaker analysis, on-device ASR and conversational LLM, embedded porting and SoC expansion — matched to your development stage.
mpWAV develops and licenses voice interface technology that makes speech clear in noisy, real-world environments, built on 25+ years of speech signal processing research.
